Precision machines & robotics / Microelectronic assembly
Assembly machine APM1000-MK1
Automated IGBT Assembly
- Robust, fast, flexible and precise
- Full automatic assembly equipment
- Solder Preforms cutting and placement from a solder ribbon
- Assembly operation : Pick & Place ; JIG Pick & Place ; DBC Pick & Place ; NTC thermistor Pick & Place
Download datasheet
: Assembly machine APM1000-MK1
Laser selective soldering – DLS
Assembly machine
- Assembly by laser soldering of chips on leadframe
- High precision: submicron resolution
- High rate: 12s per solder (variable depending on soldering time)
- Component positioning determined after vision measurement
- Equipped with an electromagnetic head (ISP SYSTEM patent), effort during welding and movement controlled
Download datasheet
: Laser selective soldering – DLS
Glue dispensing die bonding DBS
Micro-assembly machine
- Assembly machine by bonding chips from 2.5 × 2.5mm² to 10x10mm²
- Designed for large series
- Assembly rate: 6s per piece
Download datasheet
: Glue dispensing die bonding DBS
Laser sintering machine : ILAS
Micro-assembly machine
- Flexible generic machine
- Refined laser process parameters: guarantees industrialization of a successful laser process
- HMI: Programming, process monitoring and post-processing analysis
- Equipped with an electromagnetic head (ISP SYSTEM patent)
- Controlled laser beam and beam power modulated throughout the assembly process
Download datasheet
: Laser sintering machine : ILAS
Large cartesian robot
Precision positioning and assembly
- High speeds and accelerations
- Closed loop positioning on absolute measurement rule
- Friction limited to guide rails and pads only
- Lack of wear and grip
- Minimum maintenance
- Suitable for clean rooms
Download datasheet
: Large cartesian robot
Compact cartesian robot
Servo positioning by linear motors
- High precision guidance
- Linear motors
- Same repository (granite) for all axes
- Granite base decoupled from the exterior structure
- Rigid and light manipulator structures
Download datasheet
: Compact cartesian robot
Oxalate laser sintering machine
Die Bonder micro-assembly machine
- Oxalate dispenser, pick & place and laser sintering
- Small series production
- Assembly of electronic components at low pressure and temperature
- Optimal sintering quality: no voids> 50μm
- Process analysis and post treatment functionality
- Compatible with space applications
Download datasheet
: Oxalate laser sintering machine
SCARA robotic machine
Removal of electronic chips and laser soldering
- Robotic machines for depositing electronic chips and laser soldering
- Robot (6 axes) for palletizing ceramic pieces at the press outlet
Download datasheet
: SCARA robotic machine
Bumps Pick & Place
Maintaining electronic components on power module
- Gripping by suction and depositing balls (up to 250)
- Precise positioning of small objects (± 0.02mm)
- Mass: ≤ 8 kg
Download datasheet
: Bumps Pick & Place
Automatic cleaning machine
- Parts cleaning by immersion in a solvent bath
- Useful cleaning volume: 665 x 700 x 100mm
- Structure: 304 L stainless steel
- Automatic container shutters to limit evaporation of the solvent
- Tempering and drying time, oscillation: configurable via HMI
Download datasheet
: Automatic cleaning machine
Battery cell manufacturing machine
NI-Cd & LI – ION batteries
- Several machines are developed, with different functions:
- Spiraling
- Element calibration
- Li-Ion coating
- Packing elements
- Cover fitting
Download datasheet
: Battery cell manufacturing machine