This Laser soldering machine allows soldering of bared chips on bare metal lead frames. This precision machine performs the stacks to form a “sub-layer” and the automatic laying of the flow with micrometric accuracy.The chip is layed of by a dynamically controlled electromagnetic head in stress and displacement.This head (ISP System patent) controls the melting and solidification. Thus brazing is performed with optimum quality (no void).
The heat input is performed by the laserYAG laser controlled by the machine. This machine is designed for continuous production, high speed and clean room integrates traceability of manufacturing.